PCB
Mount |
Category(EIAJ) |
Package
Style |
Package
Type |
Definition |
| Through-Hole |
Dual Lead Rows |
DIP |
- |
A package with leads on both of its long sides, with 300-, 400-, 600- or
900-mil body width |
| SDIP |
DIP with a smaller lead pitch |
| HDIP |
DIP with heatspreader on its top or bottom. Thermal resistance, Rth(j-c),
is 3 to 5 °C/W. |
| Single Lead Row |
SIP |
- |
A package with a single straight row of leads |
| SSIP |
SIP with a smaller lead pitch |
| HSIP |
SIP with heatspreader on its top or bottom. Thermal resistance, Rth(j-c),
is 3 °C/W. |
| ZIP |
- |
A package whose leads are bent to alternate sides, forming into two staggered
rows |
| SZIP |
ZIP with a smaller lead pitch |
| HZIP |
ZIP with a heatspreader on its top or bottom. Thermal resistance, Rth(j-c),
is 2 to 3 °C/W. |
| Surface Mount |
Quad Lead Rows |
QFP |
- |
A package with leads on all four sides in a gull-wing configuration |
| HQFP |
QFP with leads that partially serve as a thermal fin. Thermal resistance,
Rth(j-c), is 20 to 27.5 °C/W. |
| LQFP |
QFP with a mounted height of 1.7 mm or less |
| TQFP |
QFP with a mounted height of 1.2 mm or less |
| Dual Lead Rows |
SOP |
- |
A package with leads on two sides, formed into a gull-wing configuration |
| SSOP |
SOP with a smaller lead pitch |
| HSOP |
SOP with leads that partially serve as a thermal fin. Thermal resistance,
Rth(j-c), is 12 to 13.5 °C/W. |
| Matrix |
BGA |
P-FBGA |
- |
| FC-BGA |
- |
